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Chip Supply, Inc.

Orlando, United States (US) · Electronics

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Data quality

Complete · Accuracy

Last verified

May 2026

#die and wafer processing

#ceramic packaging

#chip scale packaging (csp)

Chip Supply, Inc. is a Electronics company based in Orlando, United States (US), founded in 1979, with 50-100 employees. Chip Supply, Inc.'s profile is verified on Enterprise League.

Overview

Chip Supply, Inc is a leading provider of specialized semiconductor packaging solutions, based in Orlando, Florida. We specialize in delivering advanced interconnect solutions, including bare die, near die size packaging, and hermetic encapsulation, to support the needs of the semiconductor industry.

Chip Supply caters to a diverse range of customers, from original equipment manufacturers (OEMs) to research institutions, enabling them to accelerate product development and gain a competitive edge. Our expertise in die and wafer processing, ceramic packaging, and Chip Scale Packaging (CSP) allows us to meet complex design requirements.

As a QML MIL-PRF-38535 and ISO9001:2000 certified company founded in 1979, Chip Supply has a long history of providing reliable and innovative packaging solutions. We are committed to helping our clients achieve their goals through tailored interconnect solutions and exceptional service.

With a team of experienced professionals and a state-of-the-art facility, Chip Supply is uniquely positioned to support the evolving needs of the semiconductor market.
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Contact Details

info@chipsupply.com

Orlando, United States (US), 7725 N. Orange Blossom Trail

Founded

1979

Company Type

Private Limited Company

Employees

50-100

Categories

Electronic Manufacturers
Manufacturing
Semiconductor

Keywords

#die and wafer processing

#ceramic packaging

#chip scale packaging (csp)

Awards

• 2026 OpenSee all

Products

Default Product Image
Chip Scale Packaging (CSP)
Semiconductor

Chip Supply provides advanced Chip Scale Packaging (CSP) solutions, enabling miniaturization and enhanced performance for next-generation semiconductor devices. Our expertise in this area supports innovative designs and reduces component size.

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