VIA NEXT Technologies Inc

VIA NEXT Technologies Inc is a leading system-level IC design service company based in Taipei, Taiwan. We specialize in providing comprehensive back-end technology services for IC design, supporting customers from architecture and RTL design through to advanced packaging and mass production. With over 20 years of experience and a team of 200+ highly skilled engineers, VIA NEXT helps clients reduce development time and cost while mitigating production risk. We serve a diverse range of markets including HPC & data center, AI accelerator, communications, and storage, partnering with leading foundries and OSATs. Our expertise includes CoWoS, SoC, DFT, APR, and Chiplet technologies, offering a full design path solution.

VIA NEXT was established in 2021 and has already delivered over 200 tape-outs and productions across nodes from 5nm to 40nm. Our global presence extends to offices in Taipei, Hsinchu, Beijing, Shanghai, Singapore, and Fremont, ensuring responsive support for our international clients. We are a trusted partner for complex system-on-chip designs.

We offer a full suite of services including design, manufacturing, testing, and supply chain management, allowing our clients to focus on innovation and market leadership.