Products
FALIT® System | Laser for Semicon/Electronics/PCB
Product description
The FALIT® system is a fully integrated laser micromachining solution designed for IC chip failure analysis, including decap, cross-sectioning, delidding, and more. It offers precise and non-destructive processing capabilities, minimizing damage to sensitive components.
Key features include specialized laser sources, continuous motorized zoom, and video microscope integration. The system adapts to a wide range of epoxy mold compounds and bonding wires, ensuring reliable results.
The FALIT® system significantly reduces setup time and processing costs, making it an ideal choice for laboratories and manufacturing facilities.
Key features include specialized laser sources, continuous motorized zoom, and video microscope integration. The system adapts to a wide range of epoxy mold compounds and bonding wires, ensuring reliable results.
The FALIT® system significantly reduces setup time and processing costs, making it an ideal choice for laboratories and manufacturing facilities.