The FALIT® system is a fully integrated laser micromachining solution designed for IC chip failure analysis, including decap, cross-sectioning, delidding, and more. It offers precise and non-destructive processing capabilities, minimizing damage to sensitive components.

Key features include specialized laser sources, continuous motorized zoom, and video microscope integration. The system adapts to a wide range of epoxy mold compounds and bonding wires, ensuring reliable results.

The FALIT® system significantly reduces setup time and processing costs, making it an ideal choice for laboratories and manufacturing facilities.